Program Manager Hybrid Electronics DEVCOM Army Research Laboratory, MD, United States
Many DoD electronics technologies must perform in extreme environments that in-turn imposes demands on the materials and corresponding advanced manufacturing. The presentation will review electronic circuits directly manufactured on 3D structures. The 3D electronics materials and advanced manufacturing will be discussed in context with temperature and high shock environment designs. The presentation will explore polymer substrate materials that can be additively manufactured or molded. The presentation will include the electronics circuit materials and manufacturing that includes; circuit trace metallization, die assembly materials and over-mold structures. The project will provide a summary of electronics materials design considerations and how DoD develops manufacturing and transition the outcomes to US industrial base through reliability and standards.