Rajesh Vaddi, PhD

Sr Research Scientist
Corning Research & Development Corporation
Corning, New York

Biographical Information

Dr. Rajesh Vaddi
Sr. Research Scientist
Thin Films & Surfaces
Corning Research and Development Division

Dr. Vaddi joined Corning in 2015 after supporting Corning’s flexible electronics project under a research contract during his Graduate studies. He holds doctorate in material science and engineering and master’s in electrical engineering from State University of New York at Binghamton. He has technical expertise in micro/nanofabrication and semiconductor device physics and Glass metal interface interactions. During his time at Corning, he has developed the fundamentals and contributed to technical solutions for emerging display technologies. Additionally, he also developed the fundamentals for successful integration of Through Glass Via (TGV) substrates in packaging technology and high-performance RF and power switching products.

Dr. Vaddi has 16 published U.S Patents and has been granted 6 of them so far. He has also authored or co-authored 10 referred publications and 9 technical research reports.

Disclosure information not submitted.

Presentation(s):

• 20.2 - Integration of Through Glass Via Interconnects within Thin Film Transistor Active Matrix Backplanes

  Wednesday, May 11, 2022
  9:20 AM – 9:40 AM