System Features

Flyover^® QSFP

• 4 channels (x4 bidirectional, 8 differential pairs)
• Up to 400 Gbps aggregate (112 Gbps PAM 4)
• Compatible with MSA QSFP pluggables
• PCIe^® 6.0 capable

Double Density Flyover^® QSFP

• 8 channels (x8 bidirectional, 16 differential pairs)
• Up to 400 Gbps aggregate (56 Gbps PAM4)
• Belly-to-Belly mating for maximum density
• Backward compatible with QSFP modules
• PCIe^® 6.0 capable

800G Double Density Flyover^® QSFP

• 8 channels (x8 bidirectional, 16 differential pairs)
• Up to 800 Gbps aggregate (112 Gbps PAM4)
• Belly-to-Belly mating for maximum density
• Backward compatible with QSFP & QSFP-DD modules
• PCIe^® 6.0 capable

• Localized press-fit control and power contacts eliminate the need for a secondary cable and connector
• Sideband signals are routed through press-fit contacts for increased airflow

• One or two rows of contacts directly soldered to the cable
• Improved signal integrity by eliminating transition board and its variability
• Achieves tighter tolerances

Samtec’s proprietary co-extruded, low loss, twinax cable technology eliminates the performance limitations and inconsistencies of individually extruded dielectric twinax cabling, improving signal integrity, bandwidth and reach.

Samtec’s Flyover^® designs provide end option flexibility to create a high-speed application specific solution to meet next gen speeds. Flyover^® QSFP systems have many End 2 options, including: