This is the first in a series of virtual briefings that dive into interconnect technologies, one of Intel’s Six Pillars of Technology Innovation for delivering leadership products that unleash the full potential of data for its customers. Hong Hou, Intel vice president and general manager of the Connectivity Group, looks at how Intel is innovating interconnect technologies and transforming the way data is moved. Learn more at Intel® HPC + AI Pavilion - https://www.hpcwire.com/solution_channel/intel/
