Power Stamp Alliance

Save at least 40% of your board space with standardized, single-stage, direct power conversion.

The Power Stamp Alliance has defined a standard product footprint and functions for board-mounted 48Vin-to-low-voltage, high current applications.

These 48V direct conversion DC-DC modules - or 'power stamps' - primarily target devices being used in large data centers, high performance computing (HPC) and supercomputing applications.

Processor architectures being addressed by the Power Stamp Alliance include ASICs, AI accelerators, FPGAs, GP-GPUs, ASSPs, CPUs, and network processors moving to lower geometry, such as 3nm technology.

48V single stage power conversion offers HPC, supercomputing and data center companies a range of business and technical benefits, starting with a significant reduction in space used for on-board power conversion.

Creating the alliance and publishing the footprint creates a multi-vendor ecosystem for multiple-sourced, modular solutions.

A PSA associate member, LoadSlammer, designs and manufactures devices used for transient load testing, brings the option for a consistent, standardized testing methodology to users of power stamps.

Design engineers will be able to use a common, consistent, and repeatable load to significantly reduce validation and integration time, speeding their end-product to market and reducing risk in the design process. LoadSlammer estimates up to 30% saving in development time depending on the user’s specific configuration.