Interconnects

FireFly™ Micro Flyover System™

Samtec

Highest Density The industry-leading miniature footprint of FireFly™ allows for greater density and closer proximity to the IC, which simplifies board layout and enhances signal integrity. Performance from 14 Gbps to 28 Gbps can be achieved in the same footprint covering an area of only 0.63 square inches for an aggregate 265 Gbps/in². Ease of Routing The two-piece board level interconnect system consists of a micro high-speed edge card connector, and a positive latch connector for power and control signal communications. Isolating the signal and power in this manner helps ease trace routing, compared to array systems. Ease of Assembly The rugged two-piece edge card socket system, with weld tabs, latch locking mechanism, and loading guides, provides simplified mating and unmating of the cable assembly, compared to compression systems, which utilize mechanical screw downs and hardware.


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