Interconnects

Si-Fly™ 112 Gbps PAM4 Low-Profile High-Density Cable System New Product Icon 

Samtec

The ultra-high density design and on-package direct connect technology of Samtec’s Si-Fly™ cable system enables speeds of 25.6 TB aggregate, with a path to 51.2 TB. The signal channel eludes the BGA, routing directly from the IC package through a long-reach cable offering 5x the reach of traditional PCB topologies. The Si-Fly™ Chip Package Interconnect offers multiple configurations from 1-4 rows. Each row supports 8 pairs per row. the Si-Fly™ Chip Package Interconnect is extremely low profile featuring 3.4 mm height with 2 rows and 6.8 mm height with 4 rows. The Si-Fly™ interconnect can be mounted on the PCB or embedded on the substrate and in the package. ASIC-Adjacent or Mid-Board Latching configuration in early design stages. The BGA attach method supports greater density and optimized trace breakout region.


Video






Request Information





 
By requesting information, you agree to share the email you provided at the time of registration with the exhibitor for follow-up. Click on “Submit” to share your email or “Cancel” to cancel your information request.
 
 
Comments